4~16 Layers HDI projects, 1+N+1, 2+N+2

Layer Count: 8(2+4+2); Board Thickness:1.60mm;

Board Size:200x165mm; Min Hole Size:0.20mm;

Min Line width/space:4/4mil;

Surface Finish:Immersion Gold.

Board Size:245x158mm; Min Hole Size:0.25mm, Blind/buried Via;

Min Line width/space:4/5mil; Silver pasted filling board;

 8L HDI board(2 step)

Layer Count: 8(2+4+2);

Board Thickness:1.60mm;

Green soldermask

Microvia: 0.1mm laser, 0.3mm mechanical drilling

Min Line width/space:3/3mil;

Surface Finish:Immersion Gold.

 8L HDI board(3 step)

Layer Count: 8(3+2+3);

Board Thickness:1.60mm;

Blue soldermask

Microvia: 0.1mm laser, 0.25mm mechanical drilling

Min Line width/space:3/3mil; Surface Finish:Immersion Gold.

Application: Samsung mobile phone