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FPC Capability
No. Item Technical Data
1 Layer Count 1~8Layers
2 Min. Line Width/Space 18um(finish Cu): 3.5/3.5mil
35um(finish Cu): 4/4mil
3 Min Space Between Coverlay Opening 0.2mm
4 Edge of Coverlay Opening to Trace 0.20mm(preferred)
5 Min Space between coverlay and solder pad 0.15mm
6 Polyimide Films 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ)
7 Thermabond Adhesive Thermosetting Adhesive, 3M high adhesion tape
8 Copper Foils (RA or ED) 1/3oz, 1/2oz, 1oz
9 Stiffeners Polyimide, Rigid FR4, metal
10 Solder Resist Coverlay, LPI
11 Min. Finished Hole size 0.2mm
12 Max. Finished Hole size 6.30mm
13 Hole tolerance ±0.05mm
14 Min.space between holes 0.15mm
15 Minimum conductor edge to outline edge ≥0.1mm
16 Minimum space between coverlay and conductor ± 0.15mm
17 Hole to outline edge ≥ 0.10mm
18 Tooling tolerance Knife(Soft) tooling ± 0.25mm
Steel(Hard) tooling ± 0.05mm
CNC drill/rout ± 0.10mm
19 Maximum Layer to Layer Mis-registration ± 0.10mm
20 Copper Plated Thickness (PTH only) 8~15um;20~30um;30~70um(special)
21 Surface Finish Immersion Gold, Plating Hard Gold, OSP


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