| FPC Capability | |||
| No. | Item | Technical Data | |
| 1 | Layer Count | 1~8Layers | |
| 2 | Min. Line Width/Space | 18um(finish Cu): 3.5/3.5mil | |
| 35um(finish Cu): 4/4mil | |||
| 3 | Min Space Between Coverlay Opening | 0.2mm | |
| 4 | Edge of Coverlay Opening to Trace | 0.20mm(preferred) | |
| 5 | Min Space between coverlay and solder pad | 0.15mm | |
| 6 | Polyimide Films | 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ) | |
| 7 | Thermabond Adhesive | Thermosetting Adhesive, 3M high adhesion tape | |
| 8 | Copper Foils (RA or ED) | 1/3oz, 1/2oz, 1oz | |
| 9 | Stiffeners | Polyimide, Rigid FR4, metal | |
| 10 | Solder Resist | Coverlay, LPI | |
| 11 | Min. Finished Hole size | 0.2mm | |
| 12 | Max. Finished Hole size | 6.30mm | |
| 13 | Hole tolerance | ±0.05mm | |
| 14 | Min.space between holes | 0.15mm | |
| 15 | Minimum conductor edge to outline edge | ≥0.1mm | |
| 16 | Minimum space between coverlay and conductor | ± 0.15mm | |
| 17 | Hole to outline edge | ≥ 0.10mm | |
| 18 | Tooling tolerance | Knife(Soft) tooling | ± 0.25mm |
| Steel(Hard) tooling | ± 0.05mm | ||
| CNC drill/rout | ± 0.10mm | ||
| 19 | Maximum Layer to Layer Mis-registration | ± 0.10mm | |
| 20 | Copper Plated Thickness (PTH only) | 8~15um;20~30um;30~70um(special) | |
| 21 | Surface Finish | Immersion Gold, Plating Hard Gold, OSP | |
