Layer Count: 2~30Layers; Board thickness: 0.2~5.0mm;
Material Available: normal FR4, High Tg FR4(tg170), Halogen free, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide; Material Vendor: KingBoard, ShengYi, NanYa, Goworld, ITEQ etc; Minimum core thickness 0.10mm; minimum line width/space: 4/4mil; Minimum hole size: 0.2mm(mechanical), 0.1mm(laser); surface finish: HAL, LF-HAL, Immersion Gold/Silver/Tin, OSP, Plating Hard Gold...

 4Layer multilayer PCB
 Material: normal FR4(Tg130), 1.6mm, 2/1/1/2/oz copper finish,
 0.5mm hole, 10/12mil line width/space,
 Surface finish: Lead free HAL

6Layer high Tg material Board

Material: FR4(Tg170), S1170 (or S1000-2 & IT158 is available), 1.6mm, 2/1/1/1/1/2oz copper finish,
0.30mm via, Red soldermask, White silkscreen,
Surface finish: Immersion Gold(2~5u")

 

12L IC Test Board

Layer Count: 12 Laye
Material: FR4(Tg170), Board thickness: 3.2mm,
size: Diameter 200mm, Hole: 0.60mm(min),
Surface finish: Plating Hard Gold

 

High Frequency Board:
Layer Count: 2 Layer
Material: Taconic RF-35
Board thickness: 3.5mm
Surface finish: Immersion Gold

 
16L Multilayer Board:
Material: FR4(Tg170), Board thickness: 3.0mm, 1/1oz inner/outer copper finish,
0.25mm via hole, 4/4mil line width/space, Impedance control required,
Surface finish: Immersion Gold