General Specification:
Layer Count: 2~16Layers;
Material: FR4, PI, PET; CCopper thickness: 1/4oz~3oz; Coverlay: 1/2mil~2mil;
Board thickness: 0.07~3.0mm; Minimum trace width/space: 3.5/3.5mil;
Minimum hole size: 0.2mm (mechanical), 0,1mm(laser);
Surface finish: HAL, LF-HAL, Immersion Gold, Plating Hard Gold;
4 Layer rigid-flex
Layer Count: 2L flex + 2L rigid, 4Layer
Material: FR4 and PI; Board thickness: 0.3mm flex + 1.6mm rigid, 1oz copper finish;
Board size: 110x156mm;
Green soldermask, White silkscreen, 0.3mm hole min, 6/6mil trace width/space;
Surface finish: Lead free HAL

Material: FR4 + PI, Board thickness: 0.2mm flex, 1.2mm; 1/1/1/1/1/1oz copper finish,
0.25mm via, Green soldermask, White silkscreen, Min trace width/space: 4/4mil;
Surface finish: Immersion Gold(2~5u")
3 Layer rigid-flexLayer Count: 1 flex + 2rigid
Material: FR4 + PI, Board thickness: 0.1mm flex, 1.0mm; 1oz copper finish,
0.30mm via, Green soldermask, Min trace width/space: 4/5mil;
Surface finish: Immersion Gold

A: Combined with FPC and PCB advantages, rigid-flex circuits provides reliable 3 dimensional circuitry application with stable platform for stiffeners, components, heat steaks, pins and other possible value added items.Rigid-flex advantages & benefits:
- Better reliability, signal integrity, noise reduction, and impedance control.
- Reduces mechanical space and device weight.
- Improves design freedom.
- HDI microvia.
- Cost-saving alternative to multi-layer FPC.

