General Specification:
Layer Count: 1~4 Layer
Material: low/normal/high thermal dielectric, Domestic/5052/6061 Aluminum,
Board thickness: 1.0~2.0mm;
Surface finish: HAL/LF-HAL/OSP/Immersion Gold.
Material: low/normal/high thermal dielectric, Domestic/5052/6061 Aluminum,
Board thickness: 1.0~2.0mm;
Surface finish: HAL/LF-HAL/OSP/Immersion Gold.
Single-sided Aluminum-based PCB
Layer Count: Single-sided
Material: 5052 Al, Board thickness: 1.6mm; 1oz copper finish,
0.50mm hole, White soldermask,
Surface finish: Immersion Gold
Double-sided Aluminum-based boardLayer Count: 2 Layer
Material: Aluminum, Board thickness: 1.6mm; 1oz copper finish,
0.50mm hole, White soldermask,
0.50mm hole, White soldermask,
Surface finish: Immersion Gold
2 Layer Metal core board
Layer Count: 2 Layer
Material: Aluminum, Board thickness: 1.6mm; 1oz copper finish,
0.50mm hole, White soldermask, Min trace width/space: 10/12mil;
Surface finish: Immersion Gold
4 Layer high thermal conductive Al-based board
Layer Count: 4 Layer
Material: Aluminum, Board thickness: 1.6mm; 1oz copper finish,
0.50mm hole, White soldermask, Min trace width/space: 10/12mil;
Surface finish: Immersion Gold
0.50mm hole, White soldermask, Min trace width/space: 10/12mil;
Surface finish: Immersion Gold
