Products
General Specification:
Layer Count: 2~30Layers; Board thickness: 0.2~5.0mm;
Material Available: normal FR4, High Tg FR4(tg170), Halogen free, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide; Material Vendor: KingBoard, ShengYi, NanYa, Goworld, ITEQ etc; Minimum core thickness 0.10mm; minimum line width/space: 4/4mil; Minimum hole size: 0.2mm(mechanical), 0.1mm(laser); surface finish: HAL, LF-HAL, Immersion Gold/Silver/Tin, OSP, Plating Hard Gold...
General Specification:
Layer Count: 1-10Layers; Board thickness: 0.07~4.0mm;
Base material: Polyimide film 40um, 25um, 20um, 12um; Copper weight: 1/4oz to 3oz;
Material Vendor: Dupont, Taiflex, Panasonic, Arlon etc...
Coverlay material: Polyimide film 12.5um,35um; Photo sensitive cover coat:over 10um
Surface finish: Immersion Gold,HAL, LF-HAL,OSP; Pattern Pitch: 60um
General Specification:
Layer Count: 2~16Layers;
Material: FR4, PI, PET; CCopper thickness: 1/4oz~3oz; Coverlay: 1/2mil~2mil;
Board thickness: 0.07~3.0mm; Minimum trace width/space: 3.5/3.5mil;
Minimum hole size: 0.2mm (mechanical), 0,1mm(laser);
Surface finish: HAL, LF-HAL, Immersion Gold, Plating Hard Gold;
Gereral Specification:
Layer Count: 4~16 Layers; HDI type: 1+N+1, 2+N+2;
Board Thickness:0.8~3.2mm; Min Hole Size:0.20mm(mechanical), 0.10mm(laser);
Min Line width/space:4/4mil;
Surface Finish:Immersion Gold/Silver/Tin, HAL/Gold Fingers.
2 to 16 layers PCB Assembly and box build
PCB Assembly and turnkey OEM/ODM, contract manufacturing service,
Global and localized sourcing compliance with customer's standard,
High precision BGA and lead-free RoHS compliant process,
R-flow soldering with RoHS, wave soldering RoHS, Customized ICT and FCT testing, AOI inspection.
